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| 210 | 0 | _aIEEE trans. compon. packag. technol. | |
| 222 | 0 | _aIEEE transactions on components and packaging technologies | |
| 245 | 0 | 0 | _aIEEE transactions on components and packaging technologies |
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_aNew York : _bInstitute of Electrical and Electronics Engineers, _c1999- |
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| 300 | _av. | ||
| 310 | _aTrimestral | ||
| 500 | _aNúmeros por volumen: 4. Volúmenes por año: 1. | ||
| 500 | _ahttp://www.ieee.org/ieeexplore | ||
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_aCOMPUTACION _916621 _2EIT |
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_aTECNOLOGIA ELECTRONICA _922077 _2SP |
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_aDISPOSITIVOS SEMICONDUCTORES _917404 _2EIT |
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_aTECNOLOGIA DE LA INSTRUMENTACION _922068 _2SP |
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_aIEEE Components, Packaging, and Manafacturing Technology Society _gOtra forma del nombre: IEEE |
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_iCont. de _tIEEE transactiones on components, packaging and manufacturing technology. Part A |
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